Micro-molded fluid pressure sensor housing

ABSTRACT

A micro pressure sensor includes a sense die mounted on a substrate, a ring structure encircling the sense die, and a silicone material is overmolded to an exterior of the ring structure to form a seal with the ring structure and fills an interior of the ring structure. The ring structure has one or more legs at bottom side, which are snap fitted to the substrate through mating holes such that the ring structure encircles the sense die; and a top surface of the silicone material receives the external pressure and transmits the external pressure to the sense surface of the sense die to generate an output signal on the sense die, wherein a processor converts the output signal into a pressure reading. The pressure-transmitting media transmits a received external pressure to the sense surface of the sense die to generate an output signal from the sense die, wherein a processor converts the output signal into a pressure reading.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of, and claims the benefit ofpriority to U.S. application Ser. No. 16/448,487 entitled MICRO-MOLDEDFLUID PRESSURE SENSOR HOUSING filed on Jun. 21, 2019, the entirety ofwhich is incorporated by reference herein.

FIELD OF THE INVENTION

The present disclosure relates generally to fluid pressure sensors, andmore particularly, to disposable fluid pressure sensor.

BACKGROUND OF THE INVENTION

In many commercial areas, it is necessary to use disposable sensordevices. This is especially true with the growing demand for disposablemedical devices. However, these disposable sensor devices must generallybe produced in accordance with low cost and high volume productionmethodologies to justify the expense associated with disposing of eachsensor device.

Conventional pressure sensors, for example, as described in U.S. Pat.Nos. 5,184,107, 8,129,624 and PCT Publication no. WO2007/051779, arecharacterized by relatively complicated fabrication processes, whichleads to relatively expensive sensors which are not suitable for usagewithin disposable medical devices.

Based on the foregoing, a need exists for an improved technique tomanufacture compact pressure sensors for low cost and reliable sensordevices.

BRIEF SUMMARY OF THE INVENTION

A disposable sensor is disclosed for pressure measurement. According tothe embodiments, the disposable sensor includes a sense die configuredto output an electric signal after receiving an external pressure on asense surface; a printed circuit board (PCB) electrically connected tothe sense die, wherein the PCB provides power and signal processing forthe sense die; a ring structure encompassing the sense die, wherein thering structure has one or more legs at its bottom side, wherein the oneor more legs are snap fitted to the PCB through mating holes; and asilicone material disposed over top side of the ring structure, forminga first portion over the ring structure, and a second portion filling aninside of the ring structure, wherein the first portion receives theexternal pressure, and the second portion transmits the externalpressure to the sense surface of the sense die.

According to the embodiments, a method of building a disposable pressuresensor includes: providing a sense die on a printed circuit board (PCB),wherein the sense die is configured to output an electric signal afterreceiving an external pressure, wherein the PCB provides power andsignal processing to the sense die; providing a ring structure modulewith one or more flexible legs at bottom side, completed by injecting asilicone material over the ring structure, wherein the silicon materialovermolded to an exterior to form a seal of the ring structure top andfills within an interior of the ring structure; during assembly, theplurality of legs are inserted into the plurality of mating holes suchthat the ring structure encircles the sense die. In operation, a topsurface of the silicone material receives the external pressure andtransmits the external pressure to the sense surface of the sense die togenerate an output signal on the sense die, wherein a processor convertsthe output signal into a pressure reading.

inserting the one or more legs through mating holes in the PCB, whereinthe ring structure encompasses the sense die; and disposing siliconematerial over the top side of the ring structure, forming a firstportion silicone material over the ring structure and a second portionsilicone material inside the ring structure and resting on the sensedie; wherein the first portion silicone material receives the externalpressure, and the second portion silicone material transmits theexternal pressure to the sense die.

Preferably, the silicone material and the ring structure are opaquematerials.

Preferably, the silicone material is formed from mixing two siliconerubbers.

Preferably, the sense die is a silicon chip outfitted withpiezoresistive sensors arranged in Wheatstone bridge circuit.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying figures, in which like reference numerals refer toidentical or functionally-similar elements throughout the separate viewsand which are incorporated in and form a part of the specification,further illustrate the embodiments and, together with the detaileddescription, serve to explain the embodiments disclosed.

FIG. 1 is a perspective view of a molded ring structure for a micropressure sensor according to certain embodiments;

FIG. 2 is a cross-sectional view of the molded ring structure in FIG. 1;

FIG. 3A shows a perspective view of a micro pressure sensor and PCBassembly directly coupled to the molded ring structure in FIG. 1 withadhesives;

FIG. 3B is a cross-sectional view of the micro pressure sensor assemblyaccording to FIG. 3A;

FIG. 4 shows a cross-sectional view of another micro pressure sensor andPCB assembly in direct coupling to the ring structure using over moldedsilicone materials, according to another embodiment; and

FIG. 5A shows a schematic block diagram of the process flow forfabricating an adhesive coupled micro pressure sensor according to FIGS.3A and 3B;

FIG. 5B shows a schematic block diagram of the process flow forfabricating the directly coupled micro pressure sensor assembly,according to FIG. 4.

DETAILED DESCRIPTION OF THE INVENTION

It should be understood at the outset that although illustrativeimplementations of one or more embodiments are illustrated below, thedisclosed systems and methods may be implemented using any number oftechniques, whether currently known or not yet in existence. Thedisclosure should in no way be limited to the illustrativeimplementations, drawings, and techniques illustrated below, but may bemodified within the scope of the appended claims along with their fullscope of equivalents. The following brief definition of terms shallapply throughout the application:

The term “comprising” means including but not limited to, and should beinterpreted in the manner it is typically used in the patent context.The phrases “in one embodiment,” “according to one embodiment,” and thelike generally mean that the particular feature, structure, orcharacteristic following the phrase may be included in at least oneembodiment of the present invention, and may be included in more thanone embodiment of the present invention (importantly, such phrases donot necessarily refer to the same embodiment). If the specificationdescribes something as “exemplary” or an “example,” it should beunderstood that refers to a non-exclusive example; The terms “about” or“approximately” or the like, when used with a number, may mean thatspecific number, or alternatively, a range in proximity to the specificnumber, as understood by persons of skill in the art field.

If the specification states a component or feature “may,” “can,”“could,” “should,” “would,” “preferably,” “possibly,” “typically,”“optionally,” “for example,” “often,” or “might” (or other suchlanguage) be included or have a characteristic, that particularcomponent or feature is not required to be included or to have thecharacteristic. Such component or feature may be optionally included insome embodiments, or it may be excluded.

Configurations encompassing a pressure sense die provided together withan electronic platform like a printed circuit board (PCB) as discussedherein may be directly coupled into a micro molded structure to providea sensor. Embodiments discussed herein allow for a single sense diedirectly connect into a molded micro ring which is over molded with asilicone seal.

Certain embodiments of the pressure sensor incorporate a moldedring-like housing and a pressure sense die on PCB attached to each otherwith adhesives. FIGS. 1, 2, 3A and 3B illustrate different views of thesensor applying the adhesives coupling type, according to an embodimentof the disclosure. FIG. 1 is a perspective view of a molded ringstructure assembly 100 for direct coupling with a micro pressure sensorusing adhesives. FIG. 2 is a cross-sectional view of the molded ringstructure of FIG. 1. FIG. 3A shows a perspective view and FIG. 3Billustrates a cross-sectional view of the micro pressure senses die andPCB assembly directly coupled to the molded ring structure in FIG. 1with adhesives.

As illustrated in FIG. 1, the molded ring structure 100 may be a part ofa pressure sensor as discussed herein. The molded ring structure 100 asillustrated in FIG. 1 comprises a tubular housing defining at least onesidewall 110 and a seal structure 120 surrounding an outer surface ofthe tubular housing for creating a seal between the molded ringstructure 100 and a fluid conduit (e.g., containing a fluid for pressuremeasurement thereof). The at least one sidewall 110 of the tubularhousing defines an at least substantially smooth interior surface of thetubular housing surrounding an interior of the tubular housing, and anat least substantially smooth exterior surface of the tubular housingsurrounding an exterior of the tubular housing. When configured as aportion of a pressure sensor, the molded ring structure is configuredfor enclosing a pressure sense die within the interior of the tubularhousing, surrounded by the at least one sidewall 110. As shown in FIG.1, the molded ring structure 100 may have a circular tubular shape(characterized by a diameter and a length), although otherconfigurations may be suitable for certain implementations. For example,the tubular housing may have a rectangular cross-section (having foursidewalls 110), a triangular cross-section (having three sidewalls 110),a hexagonal cross-section (having six sidewalls 110), and/or the like.

The sidewalls of the tubular housing may comprise a molded plasticmaterial (e.g., Polysulfone, Polycarbonate, Acrylic, Stainless Steel,etc.), however it should be understood that other materials such asTeflon, glass, etc. may be used in certain embodiments. To prevent lightfrom penetrating through the at least one sidewall 110 onto the sensedie (discussed below), the at least one sidewall 110 of certainembodiments comprises opaque materials. Embodying the at least onesidewall 110 of the tubular housing as a molded plastic ring has theadvantages of a low material cost and ease of manufacturing. Asnon-limiting examples, the at least one sidewall 110 of the circulartubular housing shown in FIG. 1 may have a height between about 1 mm to5 mm, an internal diameter (measured across an interior diameter definedby the interior surface of the at least one sidewall 110) range betweenabout 1 mm to 4 mm (e.g., at least about 1.5 mm), an outer diameter(measured across an exterior diameter defined by the exterior surface ofthe at least one sidewall 110) range between about 2 mm to 6 mm, and asidewall 100 thickness between about 0.5 mm to 1 mm.

The seal structure 120 encircling an exterior surface of the at leastone sidewall 110 of the tubular housing is located proximate an upperend of the tubular housing (e.g., closer to the upper end of the tubularhousing than an opposite lower end of the tubular housing) and forms aprotruding barrier between the upper end of the molded ring structure100 and the lower end of the molded ring structure 100. In certainembodiments, the seal structure 120 comprises a resilient materialconfigured to form a fluid seal with an at least substantially smoothsurface of a fluid conduit. For example, the seal structure 120 maycomprise rubber, silicone, or other resilient polymer materials.

Shown in FIG. 2 is a cross-sectional view of the molded ring structure100 shown in FIG. 1. In the illustrated embodiment, the ring structure100 defines a ring top edge 220 at the upper end of the at least onesidewall 110 and a protruding seal structure 120. The hollow interior ofthe molded ring structure 100 (defined within the interior of the atleast one sidewall 110) accommodates a sense die assembly which will beillustrated in the next figures. As shown in FIG. 2, the at leastsubstantially smooth exterior surface of the at least one sidewall 110defines an engagement protrusion 115 configured to maintain connectionbetween the at least one sidewall 110 and the seal structure 120. In theillustrated embodiment of FIG. 2, the engagement protrusion 115 entirelyencircles the at least one sidewall 110 to facilitate connection betweenthe at least one sidewall 110 and the seal structure 120. In theillustrated embodiment, the engagement protrusion 115 has across-sectional shape corresponding to the cross-sectional shape of theseal structure 120. As a non-limiting example as shown in FIG. 2, theseal structure 120 has a trapezoidal cross-sectional shape surroundingan engagement protrusion 115 having a corresponding trapezoidalcross-sectional shape. However it should be understood that theengagement protrusion 115 need not have a cross-sectional shapecorresponding to the shape of the seal structure 120. As non-limitingexamples, the engagement protrusion 115 may have a triangularcross-sectional shape, a rectangular cross-sectional shape (or multipleparallel rectangular cross-sectional shapes), and/or the like, to securea trapezoidal seal structure 120 around an exterior surface of the atleast one sidewall 110. As illustrated in FIG. 2, the seal structure 120may be positioned adjacent the top edge 220 of the at least one sidewall110.

As also shown in FIG. 2, a lower edge 221 of the at least one sidewall110 defines one or more spacer protrusions 116 extending below a loweredge 221 of the at least one sidewall 110. As discussed in greaterdetail herein, the one or more spacer protrusions 116 may be configuredas integrated calibration components to maintain an at leastsubstantially uniform adhesive thickness between the lower edge 221 ofthe at least one sidewall 110 and a surface of a substrate (e.g., aPrinted Circuit Board (PCB)) on which the molded ring structure 100 isplaced. In the illustrated embodiment, the at least one sidewall 110defines four spacer protrusions 116 that are at least substantiallyequally spaced around the perimeter of the at least one sidewall 110,however greater or fewer spacer protrusions 116 may be utilized in otherembodiments.

FIG. 3A shows a perspective view and FIG. 3B shows a cross-sectionalview of a micro pressure sensor 300 comprising a molded ring structure100 according to one embodiment. As shown in FIGS. 3A and 3B, the micropressure sensor 300 comprises a substrate (e.g., a PCB) assembly adhered(e.g., via adhesive 350) to a molded ring structure 100 as illustratedin FIGS. 1 and 2, according to some embodiments. A pressure conductingmaterial, such as silicone material 360 shown in FIGS. 3A-3B isdispensed into the hollow interior of the of the molded ring structure100, guided by the interior surface of the at least one sidewall 110. Asillustrated in FIG. 3B, the substrate platform 370 has a sense die 380disposed thereon (within an interior of the molded ring structure 100)and encompasses power supply and/or signal processing circuitry for thesense die 380. The sense die 380 may be a silicon chip outfitted withpiezoresistive sensors arranged in Wheatstone bridge circuit. The targetpressure range may be from −10 PSI to 200 PSI. The ring structure 100 isat least substantially centered relative to the sense die 380 and isseated on a surface of the substrate platform 370. As discussed above,the spacing protrusions 116 may be positioned against the surface of thesubstrate platform 370, and adhesive 350 may be used to secure the loweredge 221 of the at least one sidewall 100 relative to the substrate. Asillustrated in FIGS. 3A-3B, the adhesive 350 surrounds the entireperimeter of the molded ring structure 100 so as to provide afluid-tight seal between the molded ring structure 100 and the surfaceof the substrate. A silicone material 360 is dispensed into the moldedring structure 100 and fills the interior of the molded ring structure100, covering the sense die 380 and a part of the substrate positionedwithin the footprint of the molded ring structure 100. Silicone 360 maybe a mixture of the two-part silicone rubber type and may be an opaquematerial to prevent light from reaching the sense die 380, which mayinduce noise in a pressure signal generated by the sensor.

In use, the micro pressure sensor 300 may be integrated into a fluidconduit, a fluid container, and/or the like to measure the fluidpressure therein. The micro pressure sensor 300 may be configured suchthat the molded ring structure 100 extends through a wall of the fluidconduit and/or fluid container, such that an upper end of the moldedring structure 100 is positioned within the fluid-containing interior ofthe fluid conduit, fluid container, and/or the like, with the remainderof the micro pressure sensor 300 is positioned external to thefluid-containing conduit, container, and/or the like. In suchembodiments, the seal structure 120 is configured to create afluid-tight seal with the wall of the fluid containing conduit,container, and/or the like, to prevent undesired fluid leakage aroundthe exterior of the molded ring structure 100.

FIG. 4 illustrates a cross-sectional view 400 of another micro pressuresensor 400. As shown therein, the micro pressure sensor 400 comprises asubstrate (e.g., PCB) directly coupled with a molded ring structure 500.In the illustrated embodiment of FIG. 4, the molded ring structure 500comprises a tubular housing defining at least one sidewall 420 and amolded pressure transmitting media (e.g., a molded silicone component)430 having a first portion 431 positioned external to the molded ringstructure 500 and adjacent an upper end of the molded ring structure 500and a second portion 432 positioned within an interior of the moldedring structure 500 (e.g., to contact a pressure sense die 480 and totransmit pressure to the pressure sense die 480). The at least onesidewall 420 of the tubular housing defines an interior surface (e.g.,having a defined roughness) of the tubular housing surrounding aninterior of the tubular housing, and a smooth exterior surface of thetubular housing surrounding an exterior of the tubular housing. Whenconfigured as a portion of a pressure sensor (as configured in FIG. 4),the molded ring structure 500 is configured for enclosing a pressuresense die 480 within the interior of the tubular housing, surrounded bythe at least one sidewall 420. As shown in FIG. 4, the molded ringstructure 500 may have a circular tubular shape (characterized by adiameter and a length), although other configurations may be suitablefor certain implementations. For example, the tubular housing may have arectangular cross-section (having four sidewalls 420), a triangularcross-section (having three sidewalls 420), a hexagonal cross-section(having six sidewalls 420), and/or the like.

The sidewalls of the tubular housing may comprise a molded plasticmaterial (e.g., Polysulfone, Polycarbonate, Acrylic, Stainless Steel,etc.), however it should be understood that other materials such asTeflon, glass, etc. may be used in certain embodiments. To prevent lightfrom penetrating through the at least one sidewall 420 onto the sensedie (discussed below), the at least one sidewall 420 of certainembodiments comprises opaque materials. Embodying the at least onesidewall 420 of the tubular housing as a molded plastic ring has theadvantages of a low material cost and ease of manufacturing.

As shown in FIG. 4, the at least one sidewall defines an upper end 421and an opposite lower end 422 configured to contact a surface of asubstrate 470. The tubular housing encircles the pressure sense die 480premounted on the substrate 470. The upper end 421 of the at least onesidewall is enlarged so as to securely engage the pressure transmittingmedia 430 (e.g., via an interference fit between the upper end 421 ofthe at least one sidewall 420 and the pressure transmitting media 430).By maintaining an interference fit between the at least one sidewall andthe pressure transmitting media 430, the pressure transmitting media maydesirably remain in contact with the pressure sense die 480, asillustrated in FIG. 4, while preventing fluid from directly contactingthe pressure sense die 480. Moreover, the at least one sidewall 420further defines a plurality of legs 4201 extending away from the lowerend 422 of the at least one sidewall 420. The plurality of legs 4201 aredefined as flexible tabs configured to engage apertures extendingthrough the substrate 470 to create a snap fit between the substrate 470and the plurality of legs 4201. A protruding foot at the tip of each leg4201 provides an interference fit lock function. For example, each leg4201 and corresponding foot are flexed away from a neutral positionwhile being pressed through the aperture of the substrate 470. Once thefoot of each leg 4201 is fully clear of the substrate 470, the legselastically return to the neutral position, thereby creating aninterference fit between the foot of each leg 4201 and the substrate470. Although illustrated as comprising a snap-fit attachment mechanismvia the illustrated legs 4201, it should be understood that in certainembodiments, the tubular housing may be adhered relative to a substrate,such as via the adhesive mechanism.

According to one embodiment, a ring structure module is made with one ormore flexible legs at bottom side, completed by injecting a siliconematerial over the ring structure. The silicon material overmolded to anexterior to form a seal of the ring structure top and fills within aninterior of the ring structure; during assembly, the plurality of legsare inserted into the plurality of mating holes such that the ringstructure encircles the sense die. In operation, a top surface of thesilicone material receives the external pressure and transmits theexternal pressure to the sense surface of the sense die to generate anoutput signal on the sense die, wherein a processor converts the outputsignal into a pressure reading.

As non-limiting examples, the at least one sidewall 420 of the circulartubular housing shown in FIG. 4 may have a height between about 2 mm to3 mm. Moreover, as a non-limiting example, the illustrated embodiment ofFIG. 4 defines three legs 4201 extending away from the lower end 422 ofthe at least one side wall 420, however it should be understood thatmore or less legs 4201 may be provided in certain embodiments to providea secure fit between the molded ring structure 500 and the substrate470. The substrate platform 470 has a sense die 480 disposed thereon(within an interior of the molded ring structure 500) and encompassespower supply and/or signal processing circuitry for the sense die 480.The sense die 480 may be a silicon chip outfitted with piezoresistivesensors arranged in Wheatstone bridge circuit. The target pressure rangemay be from −10 PSI to 200 PSI. The ring structure 500 is at leastsubstantially centered relative to the sense die 480 and seated on thesubstrate 470 by locking the legs 4201 through apertures of thesubstrate.

In the illustrated embodiment of FIG. 4, the pressure transmitting media430 is formed over the upper end 421 of the at least one sidewall 420.According to certain embodiments, a silicone material is molded over theupper end 421 of the at least one sidewall 420 to form at least aportion of the pressure transmitting media 430. The pressuretransmitting media 430 is a resilient, solid material when molded (suchthat, once cured, the pressure transmitting media 430 does not flow). Incertain embodiments, the entirety of the pressure transmitting media430, including the first portion 431 and the second portion 432 may beintegrally molded. In other embodiments, the first portion 431 and thesecond portion 432 may be separately formed and joined together whenconstructing the molded ring structure 500.

In use, the micro pressure sensor 400 may be integrated into a fluidconduit, a fluid container, and/or the like to measure the fluidpressure therein. The micro pressure sensor 400 may be configured suchthat the molded ring structure 500 extends through a wall of the fluidconduit and/or fluid container, such that an upper end of the moldedring structure 500 is positioned within the fluid-containing interior ofthe fluid conduit, fluid container, and/or the like, with the remainderof the micro pressure sensor 400 is positioned external to thefluid-containing conduit, container, and/or the like. Accordingly, thepressure transmitting medial 430 comprises a first portion 431 locatedover the at least one sidewall 420, and a second portion 432, such thatthe second portion 432 defines a fluid interface between the pressuresensor 400 and a fluid containing conduit, container, and/or the like.In such embodiments, the second portion 432 of the pressure-transmittingmedia operates as a seal structure configured to create a fluid-tightseal with the wall of the fluid containing conduit, container, and/orthe like, to prevent undesired fluid leakage around the exterior of themolded ring structure 500 and/or into the interior of the molded ringstructure 500. Fluid may contact a surface of the second portion 432 andapply a pressure thereto. That pressure is transmitted through thesecond portion 432 of the pressure-transmitting media positioned withinthe interior of the molded ring structure 500, until the pressure istransmitted to the pressure sense die 480. Because thepressure-transmitting media 432 acts as a seal against fluid entry intothe interior of the molded ring structure 500, the fluid does notcontact the pressure sense die 480 directly, however fluid pressure maybe sensed through pressure transmissions through thepressure-transmitting media 432. The output signal from the sense die480 may have a flip chip design which mounts the sense die facing downand has a back fill to contact the over-molded component, or via wirebonding connections to circuitry disposed on the substrate 470 orconnect from a set of through silicon vias (TSVs) made in a siliconbased sense die.

With continued reference to FIG. 4, the pressure-transmitting media maybe an opaque silicone material over molded on to the upper end 421 ofthe at least one sidewall 420. The tubular housing defined by the atleast one sidewall 420 may have an internal diameter between about 1 mmto 3 mm. Due at least in part to this small internal diameter, thehighly viscous silicone material flowing into the interior of thetubular housing during the molding process forms and solidifies into aninverted dome 432 lower profile having a lower-most end at the exposedsensing top surface of the sense die 480. Pressure from a sensing target(e.g., a fluid) exerted on the top surface of the moldedpressure-transmitting media 430 causes corresponding deflection of thepressure-transmitting media 430 to press on the pressure sense die 480,thereby inducing a pressure output signal from the pressure sense die480.

The compact pressure sensors disclosed above will find manyapplications, for example, where disposable medical or biologicalsensors are in high demand. For example, pressure, flow rate type ofsensors for body fluids (blood, urine, etc.) will be good candidates forthese sensors.

Sensors, such as those discussed in reference to FIGS. 1-4 may befabricated in accordance with the techniques described in FIG. 5A andFIG. 5B below.

FIG. 5A illustrates a schematic block diagram of the process flow forfabricating an adhesive coupled micro pressure sensor according to FIGS.3A and 3B. The process flow includes four major blocks:

-   -   Block 510 illustrates the process assembling an example        substrate with terminal;    -   Block 520 illustrates the process of attaching a sense die        relative to the substrate;    -   Block 530A illustrates the process of securing the seal        structure (also referred to as a “gel ring”) with the tubular        housing; and    -   Block 540 illustrates the process of packaging the sensor

In fabricating the pressure sensor encompassing a seal structure,attaching the seal structure to the sensor presents one challengingstep. As reflected in Block 530A, one example technique is usingadhesives to bond the seal structure with the tubular housing. Referringto FIG. 5A, block 510 represents a process to prepare a substrateplatform (e.g., a PCB platform). As illustrated in FIG. 5A, the PCBplatform may be patterned into circuitry arrays using a pre-preparedsolder paste as the conductive network—a process referred to as screenprint. Heating the patterns on PCB afterwards triggers reflow of thesolder paste. As a result the extra solder at edge terminals arestripped off during the reflow process, followed by removing theterminal tabs. The PCB assembly is now ready for next step of sense dieattachment.

Block 520 illustrates an example process of preparing sense dies andattaching the sense dies to a PCB assembly. As illustrated at block 520,die attach adhesive is coated on the PCB array at predeterminedlocations (e.g., using a screen printer), and sense dies and integratedcircuit (IC) elements are prepared for attachment. The sense dies arethen attached to the PCB at the desired locations via the adhesivepattern. If the adhesives are thermally curable, the PCB is thenthermally cured in an oven at a temperature safe for the dies. Followingthe curing, the cured die-on-PCB assembly is sent to a plasma cleaningsystem to remove unwanted exposed adhesives. After the cleaning, aninterconnecting step is performed in which die contacts are wire bondedto circuitry on the PCB in accordance with a standard wire bondingprocess, in which conductive materials such as gold wires are used.Block 520 illustrates the active assembling of sense dies withcorresponding PCBs, and the sensor electrical assembly is then ready forthe next step.

Still referring to FIG. 5A, block 530A illustrates an example processfor manufacturing a molded ring structure and assembling the molded ringstructure with the PCB assembly generated via the process illustrated inblock 520.

The block 530 process can also be understood with reference to thestructure in FIGS. 3A and 3B. This process typically takes place at aspecifically configured attach station. As illustrated in Block 530A,the process comprises steps for premixing silicone rubber materials Aand B in a syringe which is ultimately dispensed into the interior ofthe molded ring structure. The molded ring structure itself is molded,and the sealing structure is molded and adhered (with an adhesive) tothe exterior of the molded ring structure. The molded ring structure(e.g., as illustrated in FIGS. 1-3B) is then attached to the PCBassembly 370 with an adhesive 350 applied along the rim of the bottom ofthe ring 250. The adhesive is then cured (e.g., thermally cured in anoven) to securely attach the molded ring structure relative to the PCB.In the following step, silicone rubber mixture 360 prepared earlier inthe syringe is dispensed into the plastic molded ring 250 from its topside, filling the hollow ring and submerging the sense die 380 as shownin FIG. 3B. Silicone rubber material 360 dispensed on top and inside thering is then vacuum degassed, thermally-cured in an oven before sent tothe next stage to be finally packaged in block 540.

The block 540 process of FIG. 5A describes the sensor final packagingprocess in which the sense die/PCB assembly, and the silicone overmolded micro ring structure are all formed as one pressure sensor.

FIG. 5B shows a schematic block diagram of the process flow forfabricating the directly coupled micro pressure sensor assembly,according to FIG. 4. The FIG. 5B process flow includes four majorblocks:

-   -   Block 510 illustrates the process assembling an example        substrate with terminal;    -   Block 520 illustrates the process of attaching a sense die        relative to the substrate;    -   Block 530B illustrates the process of securing the seal        structure (also referred to as a “gel ring”) with the tubular        housing; and    -   Block 540 illustrates the process of packaging the sensor.

Processes for assembling a PCB (as illustrated in block 510), attachinga sense die to PCB (as illustrated in block 520), and packaging thesensor (as illustrated in block 540) are described above in reference toFIG. 5A, therefore the similar descriptions for these three blocks 510,520, and 540, will not be repeated in description of FIG. 5B herein.

However, in accordance with certain embodiments, a process of securing amolded ring structure relative to the PCB may be provided in accordancewith the process described in block 530B of FIG. 5B in lieu of thatdiscussed in reference to block 530A of FIG. 5A. As illustrated in block530B, the sealing structure and/or pressure-transmitting media may besecured onto the molded ring structure by overmolding, without anyadhesive or separate attachment mechanisms. As illustrated at block5301, the sealing structure (e.g., sealing structure 120 as illustratedin FIGS. 1-3B) or pressure-transmitting media (e.g.,pressure-transmitting media 310 as illustrated in FIG. 4) is overmoldedonto the at least one sidewall. The resulting molded ring structure(molded ring structure 100 or molded ring structure 500) may then beattached relative to the PCB via a specifically configured ringattaching station, as reflected at block 5302. In certain embodiments,the molded ring structure may be adhered to the PCB (as discussed inreference to FIGS. 3A-3B), or the molded ring structure may be attachedvia snap-fit attachment mechanisms, such as described in reference toFIG. 4.

The final step of packaging the sensor disclosed in block 540 alsoincludes calibration of pressure signals over standard, and adjustmentof over-molding silicone position.

In conclusion, embodiments discussed herein provide element structuresthat may be configured for use in a variety of pressure sensors. Thedesigns are cost effective at least in part because the sensingstructures could be built in large quantities with easy to work withmaterials, which may be suitable for generating disposable pressuresensors. The compact size of the designs would allow this sensors to beapplied for disposable medical and biological fluid measurements. Inaddition these sensors are more readily accommodates high volumeproduction to achieve low cost solutions.

What is claimed is:
 1. A pressure sensor, comprising: a ring structureencircling a sense die, wherein a bottom end of the ring structure isadhered to a substrate; and a pressure-transmitting media overmoldedover an upper end of the ring structure and in contact with a sensesurface of sense die, wherein the pressure-transmitting media transmitsa received external pressure to the sense surface of the sense die togenerate an output signal from the sense die, wherein a processorconverts the output signal into a pressure reading.
 2. The pressuresensor as in claim 1, wherein the pressure-transmitting media and thering structure are each characterized as being opaque.
 3. The pressuresensor as in claim 1, wherein the pressure-transmitting media isinterference fit with the ring structure.
 4. The pressure sensor as inclaim 1, wherein the sense die is a flip chip designed silicon chip. 5.The pressure sensor as in claim 4, wherein the silicon chip is outfittedwith a Wheatstone bridge circuit of piezo-resistive sensors.
 6. Thepressure sensor as in claim 1, wherein an internal diameter of the ringstructure is between about 1 mm and about 10 mm.
 7. The pressure sensoras in claim 1, wherein the sense die is configured to measure pressureswithin a range of about −10 PSI to about 200 PSI.
 8. The pressure sensoras in claim 1, wherein the pressure-transmitting media defines a sealingstructure to create a fluid-tight seal with a fluid conduit.
 9. A methodof making a pressure sensor, comprising: overmolding apressure-transmitting media around an upper end of a ring structure,wherein the pressure-transmitting media creates a fluid-tight seal witha fluid conduit; and adhering a lower end of the ring structure with thesubstrate to encircle the sense die; wherein the pressure-transmittingmedia is in contact with a sense die to transmit an external pressure tothe sense die to generate an output signal, wherein a processor convertsthe output signal into a pressure reading.
 10. The method of making apressure sensor of claim 9, wherein the ring structure and thepressure-transmitting media are each opaque.
 11. The method of making apressure sensor as in claim 9, wherein the sense die comprisespiezoresistive sensors arranged in Wheatstone bridge circuit.
 12. Apressure sensor, comprising: a substrate electrically connected to asense die, wherein the substrate comprises a plurality of mating holes;and a ring structure comprising: a silicone material disposed over thering structure, wherein the silicon material is overmolded to anexterior of the ring structure to form a seal with the ring structureand fills an interior of the ring structure; a plurality of flexiblelegs formed at a bottom of the ring structure; wherein the plurality offlexible legs are inserted into the plurality of mating holes such thatthe ring structure encircles the sense die; and wherein a top surface ofthe silicone material receives the external pressure and transmits theexternal pressure to the sense surface of the sense die to generate anoutput signal on the sense die, wherein a processor converts the outputsignal into a pressure reading.
 13. The pressure sensor of claim 12,wherein the plurality of flexible legs is snap-fit into the plurality ofmating holes.
 14. The pressure sensor as in claim 12, wherein thesilicone material and the ring structure are each opaque.
 15. Thepressure sensor as in claim 12, wherein the silicone material is formedfrom mixing two silicone rubbers.
 16. The pressure sensor as in claim12, wherein the sense die is a silicon chip outfitted withpiezoresistive sensors arranged in Wheatstone bridge circuit.
 17. Thepressure sensor as in claim 12, wherein a height of the ring structureis between about 1 mm to about 10 mm.
 18. The pressure sensor as inclaim 12, wherein an internal diameter of the ring structure is betweenabout 1 mm to about 5 mm.
 19. The pressure sensor as in claim 12,wherein the sense die measures pressure in a range of about −10 PSI toabout 200 PSI.